In addition, the tables and appendices have been updated with the latest alloy information. This "C" revision has been updated to address intentional additions to a solder alloy and impurities in the alloy. Each module is followed by an exam period where the student’s ability to navigate and exercise the document is challenged. The other two standards in this set are IPC/EIA J-STD-004, Requirements for Soldering Fluxes, and IPC/EIA J-STD-005, Requirements for Soldering Pastes This course is split up into 3 modules: Module 1: Introduction/Overview of J-STD-001. This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials to be used in the electronics industry. Solders for applications other than electronics should be procured using ASTM B-32. The IPC / EIA J-Std-001 Requirements for Soldered Electrical and Electronic Assemblies has become the authority for electronics assembly manufacturing and. Amendment by Association Connecting Electronics Industries. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. IPC J-STD-001GS Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies. This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications and for ‘‘special’’ electronic grade solders.